My name is Hongbo Bi and I am a Ph.D candidate in Mechanical Engineering under Dr. Bongtae Han at the University of Maryland, College Park. I recieved Master of Science (M.S.) degree in Mechanical Engineering from University of Maryland, College Park and and Bachelor of Engineering (B.E.) in Automatic Control from University of Science and Technology of China. I am currently entrolled into class of Flexible Macroelectronics (ENME808H) at the University of Maryland, which is taught by Prof. Teng Li.
My interest in this class of flexible macroelectronics comes from its tremendous potential of future capability that is expected to become the mainstream in elctronic industry. It will be great to touch the basis and stay on the leading edge of its development. It is nice if flexible electronics can be one of my career options.
Currently, my research interests include Nano-scale deformation measurement for nano-structures, realiability analysis for electronic packaging and flexible electronis.